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BUYING ORGANISATION

University of Strathclyde

Published procurement activity · 90 tenders

ORGANISATION DETAILS

University of Strathclyde

Buyer information published with procurement notices.

Published identifier
Not supplied
Address
Glasgow, UKM82, G1 1XU, United Kingdom
First notice
13 Mar 2025
Latest notice
15 Oct 2026
Find a TenderPublic Contracts Scotland
All tenders90£15.1bnCombined published GBP valueOther published source values: USN USN 172.6k
Open3£30.7mCombined published value
Closed17£5.1mCombined published value
Awarded49£15.1bnCombined published GBP valueOther published source values: USN USN 172.6k
Cancelled1£1.4mCombined published value
ISSUED TENDERS

17 tenders

All · 90Open · 3Closed · 17Awarded · 49Cancelled · 1

Strathclyde Pharma Solutions Equipment Service & Maintenance

University of Strathclyde · UKM82

Strathclyde Pharma Solutions, a research group within University of Strathclyde's Strathclyde Institute for Pharmacy and Biomedical Sciences is a MHRA licensed manufacturing facility, supplying investigative medicinal products to clinical trials. We require a Supplier to undertake annual servicing and calibration of equipment as

Sources Find a TenderPublished 21 Aug 2026Closes 31 Aug 2026Reference 080034-2026Sector 50000000 — Repair and maintenance services
£120kEstimated value

Supply, Delivery and Installation of Matrix Plasma Asher

University of Strathclyde · UKM82

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments

Sources Find a TenderPublished 6 Aug 2026Closes 9 Sept 2026Reference 074565-2026Sector 38000000 — Laboratory, optical and precision equipments (excl. glasses)
Value not statedNo published estimate

Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System

University of Strathclyde · UKM82

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments

Sources Find a TenderPublished 6 Aug 2026Closes 9 Sept 2026Reference 074459-2026Sector 38000000 — Laboratory, optical and precision equipments (excl. glasses)
Value not statedNo published estimate

Supply, Delivery and Installation of High Accuracy Motion Control and Imaging System

University of Strathclyde · UKM82

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments

Sources Find a TenderPublished 5 Aug 2026Closes 7 Sept 2026Reference 074374-2026Sector 38000000 — Laboratory, optical and precision equipments (excl. glasses)
Value not statedNo published estimate

Supply, Delivery and Installation of Wafer-Level Optical Tester

University of Strathclyde · UKM82

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments

Sources Find a TenderPublished 5 Aug 2026Closes 7 Sept 2026Reference 074011-2026Sector 38000000 — Laboratory, optical and precision equipments (excl. glasses)
£788kEstimated value

Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester

University of Strathclyde · UKM82

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments

Sources Find a TenderPublished 3 Aug 2026Closes 7 Sept 2026Reference 073369-2026Sector 38000000 — Laboratory, optical and precision equipments (excl. glasses)
Value not statedNo published estimate

Supply, Delivery and Installation of Laser Waveguide Writing Equipment

University of Strathclyde · UKM82

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments

Sources Find a TenderPublished 3 Aug 2026Closes 4 Sept 2026Reference 073041-2026Sector 38000000 — Laboratory, optical and precision equipments (excl. glasses)
Value not statedNo published estimate

Supply, Delivery and Installation of Optical Alignment & Packaging System

University of Strathclyde · UKM82

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments

Sources Find a TenderPublished 3 Aug 2026Closes 4 Sept 2026Reference 073040-2026Sector 38000000 — Laboratory, optical and precision equipments (excl. glasses)
Value not statedNo published estimate

Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

University of Strathclyde · UKM82

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments

Sources Find a TenderPublished 3 Aug 2026Closes 4 Sept 2026Reference 073039-2026Sector 38000000 — Laboratory, optical and precision equipments (excl. glasses)
Value not statedNo published estimate

Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter

University of Strathclyde · UKM82

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments

Sources Find a TenderPublished 31 Jul 2026Closes 1 Sept 2026Reference 072912-2026Sector 38000000 — Laboratory, optical and precision equipments (excl. glasses)
£1.2mEstimated value

Organisation details and tender classifications reflect information published by the original procurement sources. Similar buyer names are grouped only where an official identifier or compatible name and postcode provide a safe link.