Opportunity overview
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
Classification
- CPV38000000 — Laboratory, optical and precision equipments (excl. glasses)
Lots
- Lot 1Value not stated
Documents and notices
- Preliminary market engagement notice on Find a TenderOpen source ↗