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PROCUREMENT OPPORTUNITY

Silicon Wafers for Test Chips

THE OPEN UNIVERSITY · Transparency notice on Find a Tender

Tender information last checkedLast checked 30 Sept 2026, 05:26.

Opportunity overview

As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing. Phase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation. Phase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging detectors to characterise their EO performance both pre and post irradiation. Phase 3: A potential third phase subject to funding to procure Silicon wafers to manufacture another batch of either FSI or BSI soft X-ray CMOS imaging detectors for further characterisation of their EO performance both pre and post irradiation. Cost Phase 1: £220,000 Phase 2: £250,000 Phase 3: £350,00 Total: £820,000

Awarded to

Amounts belong to published awards or contracts. Where several suppliers share one value, it is labelled as shared and is not a supplier-specific allocation.

X-FAB Sarawak Sdn. Bhd.

No match
Published award value
€220k
Awarded
3 Jul 2025
Award ID
1
Status
active
Identifier
GB-PPON PLGZ-1483-CXTX
Location
Kuching · Sarawak, MY, 93350, Malaysia

Classification

No classification was supplied.

Lots

  • Lot LOT-0001Value not stated

Documents and notices

Published notice details

Additional information from the published procurement release. Fields appear only when supplied by the source; check the original notice and tender documents before acting.

Scope, procedure and submissions

Id
OUPA11504
Status
complete
Procurement Method
direct
Procurement Method Details
Direct award
Why this procedure was chosen
The following conditions are met in relation to the public contract- a) due to an absence of competition for technical reasons, only a particular supplier can supply the goods, services or works required, and b) there are no reasonable alternatives to those goods, services or works. Teledyne-e2v have previously performed a competitor analysis and based on a comparison of price and technical performance, XFAB were selected as the preferred supplier for all their silicon chip products. As a result, Teledyne's CMOS imaging device design and manufacturing plans for this project have been developed to align with XFAB's design rules and processes. Consequently, in order to meet the requirements of the ESA agreement the OU must procure wafers from XFAB to ensure compatibility with Teledyne's design and manufacturing standards.

Legal basis

Id
2023/54
Scheme
UKPGA

Procedure reasons

Entry 1
Id
singleSuppliersTechnicalReasons

Lots and requirements

Entry 1
Id
LOT-0001
Status
complete

Published documents

Entry 1
Id
conflictOfInterest
Description
Not published
Document Type
conflictOfInterest

Buyer, suppliers and contacts

Organisation 1
Id
GB-CHC-RC000391
Name
THE OPEN UNIVERSITY

Roles

buyer

Address

Region
UKJ12
Country
GB
Locality
Milton Keynes
Postal Code
MK7 6AA
Country Name
United Kingdom
Street Address
Walton Hall

Details

Classifications

Entry 1
Id
publicAuthoritySubCentralGovernment
Scheme
UK_CA_TYPE
Description
Public authority - sub-central government

Identifier

Id
RC000391
Scheme
GB-CHC

Contact

Additional Identifiers

Entry 1
Id
PYNW-6296-ZJQQ
Scheme
GB-PPON
Organisation 2
Id
GB-PPON-PLGZ-1483-CXTX
Name
X-FAB Sarawak Sdn. Bhd.

Roles

supplier

Address

Region
MY
Country
MY
Locality
Kuching · Sarawak
Postal Code
93350
Country Name
Malaysia
Street Address
1 Silicon Drive, Sama Jaya Free Industrial Zone

Details

Vcse
No
Scale
large
Sheltered Workshop
No
Public Service Mission Organization
No

Identifier

Id
PLGZ-1483-CXTX
Scheme
GB-PPON

Contact

Telephone
+6082354888

Award information

Award 1
Id
1
Date
4 Jul 2025, 00:00
Title
Silicon Wafers for Test Chips
Status
active
Has Renewal
Yes
Above Threshold
Yes
Main Procurement Category
goods

Items

Item 1
Id
LOT-0001
Related Lot
LOT-0001

Delivery locations

Entry 1
Region
UKC
Country
GB
Country Name
United Kingdom
Entry 2
Region
UKD
Country
GB
Country Name
United Kingdom
Entry 3
Region
UKE
Country
GB
Country Name
United Kingdom
Entry 4
Region
UKF
Country
GB
Country Name
United Kingdom
Entry 5
Region
UKG
Country
GB
Country Name
United Kingdom
Entry 6
Region
UKH
Country
GB
Country Name
United Kingdom
Entry 7
Region
UKI
Country
GB
Country Name
United Kingdom
Entry 8
Region
UKJ
Country
GB
Country Name
United Kingdom
Entry 9
Region
UKK
Country
GB
Country Name
United Kingdom
Entry 10
Region
UKC
Country
GB
Country Name
United Kingdom
Entry 11
Region
UKD
Country
GB
Country Name
United Kingdom
Entry 12
Region
UKE
Country
GB
Country Name
United Kingdom
Entry 13
Region
UKF
Country
GB
Country Name
United Kingdom
Entry 14
Region
UKG
Country
GB
Country Name
United Kingdom
Entry 15
Region
UKH
Country
GB
Country Name
United Kingdom
Entry 16
Region
UKI
Country
GB
Country Name
United Kingdom
Entry 17
Region
UKJ
Country
GB
Country Name
United Kingdom
Entry 18
Region
UKK
Country
GB
Country Name
United Kingdom

Additional Classifications

Entry 1
Id
38000000
Scheme
CPV
Description
Laboratory, optical and precision equipments (excl. glasses)

Value

Amount
220,000
Currency
EUR
Including VAT
220,000

Renewal

Description
Extension End Date: Phase 2: March 2028 Phase 3: September 2029

Documents

Entry 1
Id
037530-2025
Format
text/html
Notice Type
UK5
Description
Transparency notice on Find a Tender
Document Type
awardNotice
Published
4 Jul 2025, 15:42
Entry 2
Id
037553-2025
Format
text/html
Notice Type
UK6
Description
Contract award notice on Find a Tender
Document Type
awardNotice
Published
4 Jul 2025, 16:22

Suppliers

Supplier 1
Id
GB-PPON-PLGZ-1483-CXTX
Name
X-FAB Sarawak Sdn. Bhd.

Milestones

Entry 1
Id
1
Type
futureSignatureDate
Status
scheduled
Due
17 Jul 2025, 23:59

Related lots

LOT-0001

Contract period

Ends
31 Jan 2026, 23:59
Starts
18 Jul 2025, 00:00
Max Extent Date
1 Oct 2029, 23:59

Standstill Period

Ends
16 Jul 2025, 23:59

Contracts and changes

Entry 1
Id
1
Title
Silicon Wafers for Test Chips
Status
active
Award ID
1
Date Signed
17 Jul 2025, 00:00
Has Renewal
Yes
Above Threshold
Yes
No Agreed Metrics Rationale
Not applicable.

Value

Amount
220,000
Currency
EUR
Including VAT
220,000

Period

Ends
31 Jan 2026, 23:59
Starts
18 Jul 2025, 00:00
Max Extent Date
1 Oct 2029, 23:59

Renewal

Description
Extension End Date: Phase 2: March 2028 Phase 3: September 2029

Documents

Entry 1
Id
049225-2025
Format
text/html
Notice Type
UK7
Description
Contract details notice on Find a Tender
Document Type
contractNotice
Published
15 Aug 2025, 15:27

Recorded locations

  • Buyer location · Milton Keynes · UKJ12 · MK7 6AA · United Kingdom

Notice and amendment history

1 published notice version reviewed by ProcuraAxis.

1 VERSION
  1. ocds-h6vhtk-055960-2025-08-15T15:27:18+01:00Transparency notice on Find a Tender ·