ProcuraAxisBeta
Sign inCreate Free Account
Home / Opportunities / Opportunity
PROCUREMENT OPPORTUNITY

Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT

University of Strathclyde · compiled

Tender information last checkedLast checked 30 Sept 2026, 02:08.

Opportunity overview

The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems. High-efficiency grinder/polisher for wafers A Deionised Water Recycling Unit Automatic Cleaning System for wafers

Awarded to

Amounts belong to published awards or contracts. Where several suppliers share one value, it is labelled as shared and is not a supplier-specific allocation.

Disco Hi-Tech UK Ltd

Match pending…
Contract value
£1m
Awarded
Not supplied
Contract signed
29 Jul 2025
Award ID
048485-2025-UOS-35651-2025-1
Status
active
Location
Crawley, UK, RH117XX, United Kingdom

Classification

  • CPV31712330 — Semiconductors
  • CPV31710000 — Electronic equipment

Lots

  • The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.Value not stated

Published notice details

Additional information from the published procurement release. Fields appear only when supplied by the source; check the original notice and tender documents before acting.

Scope, procedure and submissions

Id
UOS-35651-2025
Status
complete
Has Recurrence
No
Review Details
Precise information on deadline(s) for review procedures: An economic operator that suffers, or risks suffering, loss or damage attributable to a breach of duty under the Public Contracts (Scotland) Regulations 2015(SSI2015/446) (as amended) may bring proceedings in the Sheriff Court or the Court of Session.
Procurement Method
open
Main Procurement Category
goods
Procurement Method Details
Open procedure

Covered By

GPA

Bid Opening

Date
20 Jun 2025, 12:00

Legal basis

Id
32014L0024
Scheme
CELEX

Expected award period

Starts
20 Jun 2025, 12:00

Tender Period

Ends
20 Jun 2025, 12:00

Contract terms

Has Electronic Payment
Yes
Has Electronic Ordering
Yes
Electronic Invoicing Policy
allowed

Classification

Id
31712330
Scheme
CPV
Description
Semiconductors

Submission terms

Languages

en

Bid Validity Period

Duration In Days
120

Submission Method

electronicSubmission

Selection criteria

Criteria

Criterion 1
Type
economic
Minimum
4B.5.1- 4B5.3 Insurances Insurance requirements are in line with levels identified in the UOS standard Terms and Conditions. It is a requirement of this contract that bidders can hold or commit to obtain prior to the commencement of any subsequently awarded contract, the types of insurance indicated below: The Contractor shall maintain in force with reputable insurers Employer’s (Compulsory) Liability Insurance = GBP 10m Public and Product Liability Insurance = GBP 10m Professional Risk Indemnity Insurance = GBP 2m In respect of any one incident and unlimited as to numbers of claims
Description
4B 1.2 Turnover Bidders will be required to have an average yearly turnover of a minimum of 4,000,000 GBP for the last 3 (three) years, to ensure the University is protected from any unforeseen financial risks that may impact the supplier or supply chain.

Applies To

supplier
Criterion 2
Type
technical
Description
4C.1.2 Previous Experience Bidders will be required to provide three (3) examples that demonstrate that they have the relevant experience to deliver the equipment as stated in the Contract Notice.

Applies To

supplier

Lots and requirements

Entry 1
Id
1
Status
cancelled
Has Options
Yes
Has Renewal
No
Description
The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.

Options

Description
The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Award criteria

Criteria

Criterion 1
Name
Quality
Type
quality
Description
60
Criterion 2
Type
price
Description
40

Contract period

Duration In Days
900

Submission terms

Variant Policy
notAllowed

Items and delivery

Item 1
Id
1
Related Lot
1

Delivery locations

Entry 1
Region
UKM82
Entry 2
Region
UKM82

Additional Classifications

Entry 1
Id
31710000
Scheme
CPV
Description
Electronic equipment

Buyer, suppliers and contacts

Organisation 1
Id
GB-FTS-135284
Name
University of Strathclyde

Roles

buyer
centralPurchasingBody

Address

Region
UKM82
Locality
Glasgow
Postal Code
G1 1XU
Country Name
United Kingdom
Street Address
Learning & Teaching Building, 49 Richmond Street

Details

Classifications

Entry 1
Id
BODY_PUBLIC
Scheme
TED_CA_TYPE
Description
Body governed by public law
Entry 2
Id
09
Scheme
COFOG
Description
Education

Identifier

Legal Name
University of Strathclyde

Contact

Name
Anna Sanina
Telephone
+44 7811592949
Organisation 2
Id
GB-FTS-2553
Name
Glasgow Sheriff Court

Roles

reviewBody

Address

Locality
Glasgow
Postal Code
G5 9DA
Country Name
United Kingdom
Street Address
1 Carlton Place

Identifier

Legal Name
Glasgow Sheriff Court
Organisation 3
Id
GB-FTS-145731
Name
Disco Hi-Tech UK Ltd

Roles

supplier

Address

Region
UK
Locality
Crawley
Postal Code
RH117XX
Country Name
United Kingdom
Street Address
Unit 34, Basepoint Business Centre

Details

Scale
large

Identifier

Legal Name
Disco Hi-Tech UK Ltd

Contact

Telephone
+44 1293817730

Award information

Award 1
Id
048485-2025-UOS-35651-2025-1
Status
active

Suppliers

Supplier 1
Id
GB-FTS-145731
Name
Disco Hi-Tech UK Ltd

Related lots

1

Contracts and changes

Entry 1
Id
048485-2025-UOS-35651-2025-1
Status
active
Award ID
048485-2025-UOS-35651-2025-1
Date Signed
30 Jul 2025, 00:00

Value

Amount
1,005,000
Currency
GBP

Recorded locations

  • Buyer location · Glasgow · UKM82 · G1 1XU · United Kingdom
  • Delivery location · UKM82

Notice and amendment history

1 published notice version reviewed by ProcuraAxis.

1 VERSION
  1. ocds-h6vhtk-0518c2-2025-08-13T15:38:49+01:00compiled ·