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PROCUREMENT OPPORTUNITY

Supply, Delivery and Installation of wafer dicing kit for NMIS

University of Strathclyde · compiled

Tender information last checkedLast checked 29 Sept 2026, 19:22.

Opportunity overview

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.

Awarded to

Amounts belong to published awards or contracts. Where several suppliers share one value, it is labelled as shared and is not a supplier-specific allocation.

S3 Alliance Ltd

Match pending…
Contract value
£305.4k
Awarded
Not supplied
Contract signed
4 Dec 2024
Award ID
001435-2025-1
Status
active
Location
Derry, UKN, BT48 8SE, United Kingdom

Classification

  • CPV31712330 — Semiconductors

Lots

  • Saw DicingValue not stated
  • Laser DicingValue not stated
  • Scribe & BreakValue not stated

Published notice details

Additional information from the published procurement release. Fields appear only when supplied by the source; check the original notice and tender documents before acting.

Scope, procedure and submissions

Id
UOS-30411-2024
Status
complete
Has Recurrence
No
Review Details
An economic operator that suffers, or risks suffering, loss or damage attributable to a breach of duty under the Public Contracts (Scotland) Regulations 2015(SSI2015/446) (as amended) may bring proceedings in the Sheriff Court or the Court of Session.
Procurement Method
open
Main Procurement Category
goods
Procurement Method Details
Open procedure

Covered By

GPA

Bid Opening

Date
22 Jul 2024, 12:00

Address

Street Address
University of Strathclyde

Legal basis

Id
32014L0024
Scheme
CELEX

Lot Details

Maximum Lots Bid Per Supplier
9,999,999

Expected award period

Starts
22 Jul 2024, 12:00

Tender Period

Ends
22 Jul 2024, 12:00

Communication

Contract terms

Has Electronic Payment
Yes
Has Electronic Ordering
Yes
Electronic Invoicing Policy
allowed

Classification

Id
31712330
Scheme
CPV
Description
Semiconductors

Submission terms

Languages

en

Bid Validity Period

Duration In Days
120

Submission Method

electronicSubmission

Selection criteria

Criteria

Criterion 1
Type
economic
Minimum
4B.5.1- 4B5.3 Insurances Insurance requirements are in line with levels identified in the UOS standard Terms and Conditions. It is a requirement of this contract that bidders can hold or commit to obtain prior to the commencement of any subsequently awarded contract, the types of insurance indicated below: The Contractor shall maintain in force with reputable insurers Employer’s (Compulsory) Liability Insurance = GBP 10m Public and Product Liability Insurance = GBP 10m Professional Risk Indemnity Insurance = GBP 1m In respect of any one incident and unlimited as to numbers of claims
Description
4B 1.2 Turnover Bidders will be required to have the average yearly turnover to participate in the relevant lot (see below) This is to ensure the University is protected from any unforeseen financial risks that may impact the supplier or supply chain. Lot 1 - GBP 600,000 for the last 3 (three) years Lot 2 – GBP 2,000,000 for the last 3 (three) years Lot 3 - GBP 1,600,000 for the last 3 (three) years

Applies To

supplier
Criterion 2
Type
technical
Description
4C.1.2 Previous Experience Bidders will be required to provide three (3) examples that demonstrate that they have the relevant experience to deliver the equipment as stated in the Contract Notice.

Applies To

supplier

Lots and requirements

Entry 1
Id
1
Title
Saw Dicing
Status
active
Has Options
Yes
Has Renewal
No
Description
The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 1 – Saw Dicing

Options

Description
The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

Award criteria

Criteria

Criterion 1
Name
quality
Type
quality
Description
50
Criterion 2
Type
price
Description
50

Contract period

Duration In Days
540

Submission terms

Variant Policy
notAllowed
Entry 2
Id
2
Title
Laser Dicing
Status
active
Has Options
Yes
Has Renewal
No
Description
The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 2 – Laser Dicing

Options

Description
The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

Award criteria

Criteria

Criterion 1
Name
quality
Type
quality
Description
50
Criterion 2
Type
price
Description
50

Contract period

Duration In Days
540

Submission terms

Variant Policy
notAllowed
Entry 3
Id
3
Title
Scribe & Break
Status
cancelled
Has Options
Yes
Has Renewal
No
Description
The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 3 – Scribe & Break

Options

Description
The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

Award criteria

Criteria

Criterion 1
Name
quality
Type
quality
Description
50
Criterion 2
Type
price
Description
50

Contract period

Duration In Days
540

Submission terms

Variant Policy
notAllowed

Items and delivery

Item 1
Id
1
Related Lot
1

Delivery Location

Description
University of Strathclyde

Delivery locations

Entry 1
Region
UKM82

Additional Classifications

Entry 1
Id
31712330
Scheme
CPV
Description
Semiconductors
Item 2
Id
2
Related Lot
2

Delivery locations

Entry 1
Region
UKM82

Additional Classifications

Entry 1
Id
31712330
Scheme
CPV
Description
Semiconductors
Item 3
Id
3
Related Lot
3

Delivery locations

Entry 1
Region
UKM82
Entry 2
Region
UKM82

Additional Classifications

Entry 1
Id
31712330
Scheme
CPV
Description
Semiconductors

Buyer, suppliers and contacts

Organisation 1
Id
GB-FTS-73570
Name
University of Strathclyde

Roles

buyer
centralPurchasingBody

Address

Region
UKM82
Locality
Glasgow
Postal Code
G1 1XQ
Country Name
United Kingdom
Street Address
McCance Building, 16 Richmond Street

Details

Classifications

Entry 1
Id
BODY_PUBLIC
Scheme
TED_CA_TYPE
Description
Body governed by public law
Entry 2
Id
09
Scheme
COFOG
Description
Education

Identifier

Legal Name
University of Strathclyde

Contact

Telephone
+44 7811592949
Organisation 2
Id
GB-FTS-220
Name
Glasgow Sheriff Court

Roles

reviewBody

Address

Locality
Glasgow
Country Name
United Kingdom

Identifier

Legal Name
Glasgow Sheriff Court
Organisation 3
Id
GB-FTS-135190
Name
S3 Alliance Ltd

Roles

supplier

Address

Region
UKN
Locality
Derry
Postal Code
BT48 8SE
Country Name
United Kingdom
Street Address
Skeoge Industrial Estate, Beraghmore Road

Details

Scale
sme

Identifier

Legal Name
S3 Alliance Ltd

Award information

Award 1
Id
001435-2025-1
Title
Scribe & Break
Status
active

Suppliers

Supplier 1
Id
GB-FTS-135190
Name
S3 Alliance Ltd

Related lots

3

Contracts and changes

Entry 1
Id
001435-2025-1
Title
Scribe & Break
Status
active
Award ID
001435-2025-1
Date Signed
4 Dec 2024, 00:00

Value

Amount
305,414
Currency
GBP

Recorded locations

  • Buyer location · Glasgow · UKM82 · G1 1XQ · United Kingdom
  • Delivery location · UKM82

Notice and amendment history

1 published notice version reviewed by ProcuraAxis.

1 VERSION
  1. ocds-h6vhtk-047100-2025-01-16T08:21:37Zcompiled ·